Thermal fatigue and failure of electronic power device substrates
نویسندگان
چکیده
منابع مشابه
Thermal fatigue and failure of electronic power device substrates
Electronic power devices used for transportation applications (automotive and avionics) experience severe temperature variations, which promote their thermal fatigue and failure. For example, for power modules mounted on the engine of an aircraft, temperature variations range from –55°C (in the worst case of storage before takeoff) to +200°C (flight). Direct bonded copper (DBC) substrates are u...
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ژورنال
عنوان ژورنال: International Journal of Fatigue
سال: 2009
ISSN: 0142-1123
DOI: 10.1016/j.ijfatigue.2009.03.011